发明名称 WAFER PROCESSING SYSTEM
摘要 PURPOSE: To provide a wafer processing equipment which can hold wafers in a slant position with simple-structure and without employing a complex mechanical control mechanism. CONSTITUTION: This system is provided with a wafer processing chamber 3 which has a wafer holding section 7 and a wafer mounting section 9. The wafer holder section 7 can move up and down, holding a wafer 6 carried in by a carrier arm 5 through a gate 4 horizontally from the rear face. The wafer mounting section 9 is installed below the wafer holding section 7 and has a slant face 8. The wafer mounting section 9 gets the wafer 6 off from the wafer holding section 7 when the wafer 6 is lowered by the wafer holding section 7 and puts it on its slant face 8.
申请公布号 JPH08213448(A) 申请公布日期 1996.08.20
申请号 JP19950017715 申请日期 1995.02.06
申请人 HITACHI LTD 发明人 ISHIKAWA KATSUHIKO;TANABE YOSHIKAZU;TOMIOKA HIDEKI;SAITO YOSHIO
分类号 C30B25/12;H01L21/304;H01L21/677;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 C30B25/12
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