发明名称 |
Method and apparatus for wafer chamfer polishing |
摘要 |
A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60 DEG to transfer the wafers. |
申请公布号 |
US5547415(A) |
申请公布日期 |
1996.08.20 |
申请号 |
US19930072741 |
申请日期 |
1993.06.07 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
HASEGAWA, FUMIHIKO;OHTANI, TATSUO;KURODA, YASUYOSHI |
分类号 |
H01L21/304;B24B9/00;B24B9/06;B24B37/00;B24B41/00;B24B41/06;(IPC1-7):B24B9/06 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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