| 摘要 |
<p>PURPOSE: To provide a semiconductor device which is lessened in thermal stress or thermal strain when it is manufactured or in operation so as to protect its component members against deformation or damage by a method wherein a metal support member bonded to the one side of a metal bonded circuit board opposite to its other side where a semiconductor element is mounted is formed of composite material composed of first metal whose main component is Mo or W and second metal. CONSTITUTION: A ceramic and a metal board are bonded together into a metal bonded circuit board, and a semiconductor element is mounted on the metal bonded circuit board. A metal support member 125 is bonded to the one side of the circuit board opposite to its other side where the semiconductor element is mounted. The metal support member 125 is formed of composite material composed of first metal of Mo or W high in thermal conductivity and small in thermal expansion coefficient and second material 125B high in thermal conductivity. By this setup, the thermal expansion coefficient of the metal support member 125 is small and approximate to that of an insulating member, so that a thermal stress or a thermal strain is not left inside a solder layer interposed between the metal support member 125 and the insulating member. Therefore, the metal support member 125 and the insulating member are not deformed or warped.</p> |
