发明名称 Heat sink and printed circuit board combination
摘要 A heat conductor has a plurality of resilient elongate elements, each being connected to a surrounding base of the conductor through two neck portions and being pivoted about its common axis. Two end portions of each elongate element are curved. When the heat conductor is mounted on a heat sink which is held over a plurality of electronic components mounted upon a printed circuit board, the curved end portions contact both the components and the heat sink with an appropriate pressure, because of the torsional action of the neck portions. The elongate elements provide short thermal paths to directly conduct the heat generated by the components to the heat sink.
申请公布号 US5548090(A) 申请公布日期 1996.08.20
申请号 US19950517327 申请日期 1995.08.21
申请人 NORTHERN TELECOM LIMITED 发明人 HARRIS, MARK R.
分类号 H01L23/367;H01L23/433;H05K7/20;(IPC1-7):H05K1/00 主分类号 H01L23/367
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