| 摘要 |
PURPOSE: To provide the inner lead wire connecting structure of a semiconductor device, wherein a soldering of an inner lead wire to a main circuit terminal is efficiently carried out in a short heating time. CONSTITUTION: A power semiconductor element mounted on an insulating board, a main circuit terminal 4 which is supported at a terminal block for being led outside, and an auxiliary terminal are assembled in a package composed of a metal base plate and an outer resin case for the formation of a semiconductor device, wherein a lead wire 7 is soldered between the main circuit terminal 4 and the auxiliary terminal for inner wiring, a tongue 4c small in width and thermal capacity is provided to a part of a conductor piece 4a of the main circuit terminal 4 by cut and lift, and the core wire 7a of the lead wire is tied to the tongue 4c, or the tip of the lead wire is inserted into a small hole in the tongue 4a and soldered. |
