| 摘要 |
PURPOSE: To provide a multilayer printed circuit board with an isolation wiring region flattened suitably without a defect in continuity between the isolation wiring and a wiring connected through a connection hole in a small number of manufacturing steps. CONSTITUTION: A dummy wiring 4D and a dummy connection hole 6D are formed around an isolated connection hole 6 between an isolation wiring 4B and an upper wiring 7 on a multilayer wiring board. The dummy wiring 4D in the isolation wiring region is made as flat as a region of an integrated wiring 4A formed on a face of an interlayer insulating film. In addition, residual gas caused by a rotation spread-type insulating film (SOG film) as the interlayer insulating film is dispersed through the dummy connection hole 6D. Especially, a defect in lamination at a buried metallic film in the connection hole 6 can be prevented. The dummy wiring 4D is formed with the isolation wiring 4B in the same step, and the dummy connection hole 6D is formed with the connection hole 6 in the same step. |
