MULTILAYER INTEGRATED CIRCUIT PACKAGE AND ITS MANUFACTURE,申请号JP19950306868-传众专利搜索

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发明名称	MULTILAYER INTEGRATED CIRCUIT PACKAGE AND ITS MANUFACTURE
摘要
申请公布号	JPH08213732(A)	申请公布日期	1996.08.20
申请号	JP19950306868	申请日期	1995.10.30
申请人	HEWLETT PACKARD CO <HP>	发明人	RAJIENDORA DEII PENZU
分类号	H05K1/14;H05K3/40;(IPC1-7):H05K1/14	主分类号	H05K1/14
代理机构		代理人
主权项
地址

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