| 摘要 |
PURPOSE: To obviate two photolithography processes conventionally required and any separate layer or conductive material in the manufacture of an integrated circuit with a fuse element incorporated. CONSTITUTION: A customizable integrated circuit 15 includes a fuse element 19, a contact pad 21, and windows 31, 33 that penetrate an insulating layer 23 toward the element and pad, respectively. The window 33 above the contact pad 33 extends to the pad, and exposes the surface of the pad. The window 31 above the fuse element does not extend to the element, and the fuse element is covered with the thin film of insulator. The fuse element and contact pad are simultaneously formed on the same surface of a substrate by a single photolithography transferring process. At least one narrow resist slit is positioned on the fuse element, and the windows, different in depth from each other, are thereby formed above the element and pad by one etching process. The etch rate of the fuse element area is lower than that of the contact pad area because of the micro loading effect. |
