| 摘要 |
PURPOSE: To provide an evacuating device of a mounting device capable of surely improving the control accuracy of a rod by reducing the moving resistance of the rod to evacuate a work to be evacuated. CONSTITUTION: An suction device D1 of a die bonder is provided with a rod 1, a hydrostatic bearing 2 and a head part 3. A rod body 9 to constitute the rod 1 is straight and circular in section, and is provided with a suction port 10, a discharge port 13 and a first suction passage 14 as a flow passage. The suction port 10 is formed at the tip of the rod body 9, and evacuates an IC chip 6. The discharge port 13 is formed in the outer circumferential surface of the rod body 9. The first evacuating passage 14 communicates the suction port 10 with the discharge port 13. The hydrostatic bearing 2 supports the rod 1 in a movable and non-contact manner by the pressurized fluid. The hydrostatic bearing 2 is fixed in the longitudinal direction relative to the lower end surface of the head part 3. A magnet 32 is provided on the rod 1 side, and a coil 34 is provided on the head 3 side. |
