| 摘要 |
PURPOSE: To enable a resist film on an element such as semiconductor substrate, etc., to be removed simply without fail in the resist removing device using an adhesive sheet. CONSTITUTION: The resist removing device wherein an adhesive sheet is formed onto an element with a resist pattern so as to remove the resist on the surface of the element by releasing the adhesive sheet is provided with a preprocessing mechanism 13 to deteriorate the bond properties of the resist on the element surface, an adhesive sheet bonding mechanism 8 bonding the adhesive sheet on the surface of the processed element by the preprocessing mechanism 13 as well an adhesive sheet releasing mechanism 9 releasing the bonding adhesive sheet from the element surface. |
