| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming conductive bumps which can eliminate drawbacks of evaporation and electroplating technique and form bumps having accurate shapes and accurate sizes, at desired positions. SOLUTION: An imageable conductive layer 18 is deposited on a semiconductor device 10 and brought into contact with the I/O pad of a final metallization layer 14, and conductive bumps 24 are formed on the semiconductor device 10. The imageable conductive material is formed of imageable acryl resin containing conducting particles. In an embodiment, the imageable conductive layer is exposed to radiation 23 by using a mask having transparent material 21 of a pattern corresponding to the desirable pattern of conductive bumps. The imageable conducting layer is developed, the unexposed part of the layer is eliminated, and a plurality of conductive bumps 24 are left on the I/O pad of the device. When the imageable conductive material is formed, positive resin also may be used.
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