| 摘要 |
<p>PURPOSE: To provide a method for mounting a semiconductor device in which the influence is scarcely given to the other in the case of replacing a chip. CONSTITUTION: An elastic element 4 is so provided that the sum of the thickness (height) of a chip 1 placed on a circuit board B and the thickness (height) of the element 4 is larger than the protruding length of a leg 3a at the leg 3a side of a cap 3 having the leg 3a, the chip 1 is sticked to the element 4, and the leg 3a of the cap 3 is sticked to the board B in the state that the part of the chip 1 protrudes from the leg 3a of the cap 3 to thereby press the back surface of the chip 1 by the element 4 to bring the bump 2 of the chip 1 into pressure contact with the wiring pattern A on the board B.</p> |
