| 摘要 |
PROBLEM TO BE SOLVED: To minimize stresses which are introduced thermally and mechanically into a semiconductor during solder bonding by arranging an adaptive layer metallization between a semiconductor and a semiconductor submount. SOLUTION: An adaptive layer 206 is introduced to a p-side of a semiconductor laser 104 between a semiconductor boundary face 302 and a hard AuSn solder bonding 106. Gold is selected for the adaptive layer 206, in order to provide high thermal conductivity, while suppressing mechanical stress on a semiconductor device 104. A barrier layer 208 is introduced between the adaptive layer 206 and the hard solder bonding 106 and a wet layer 210 is introduced between the barrier layer 208 and the hard solder bonding 106. By having an adaptive layer 204 develop so as to be constituted of a plurality of layers 206, 208 and 210, thermally and mechanically, stresses introduced into the semiconductor can be minimized during solder bonding.
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