发明名称 |
Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency |
摘要 |
A heat sink is attached to a semiconductor element functioning as an exothermic element, which is mounted on a circuit board and has a predetermined allowable power consumption, thereby cooling the semiconductor element. A semiconductor element having a lower allowable power consumption than the semiconductor element having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink, is connected to a heat conductive auxiliary member connected at one end to the heat sink. Thus, the heat radiation efficiency of the semiconductor element having the lower allowable power consumption is enhanced.
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申请公布号 |
US5548161(A) |
申请公布日期 |
1996.08.20 |
申请号 |
US19950491240 |
申请日期 |
1995.06.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIRANO, NAOHIKO;YAMAJI, YASUHIRO |
分类号 |
H01L23/36;H01L23/367;H01L23/467;(IPC1-7):H01L23/24;H01L23/10;H01L23/34;H01L23/02 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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