| 摘要 |
PURPOSE:To prevent blackening and contact resistance increase in a high- temperature environment by constructing an anti-diffusion layer from a plurality of plating layers, selecting a predetermined group of metals for each plating layer, and specifying the thickness of each plating layer. CONSTITUTION:This conductive member has base material made of copper or copper alloy and an Sn plating layer 0.1 to 0.3mum thick formed over the base material, with an air-diffusion layer formed over the Sn plating layer. The anti-diffusion layer has a plating layer 0.002 to 0.20mum thick made of a metal selected from among Au, Pt and Pd to inhibit diffusion of the Cu from the base material and to achieve chemical stability even in a high-temperature environment. The anti-diffusion layer has another plating layer 0.01 to 1.0mum thick made of a metal selected from among Ni, Cr and Ag. The anti-diffusion layer has a another plating layer 0.05 to 2.0mum thick made of a metal selected from Zn and Pb. The plating layers all inhibit diffusion of the Cu from the base material and, when used for a long time in a high-temperature environment, can reduce contact resistance to a low value.
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