发明名称 CERAMIC BOARD FOR CHIP-LIKE ELECTRONIC DEVICE AND PRODUCTION THEREOF
摘要 PURPOSE: To form a burr-free ceramic board by providing a curved surface having predetermined radius of curvature at all ridges and corners. CONSTITUTION: A sintered ceramic green sheet 10 of 4mm thick containing 96% of Al2 O3 is cut into a piece of 100×150mm. The green sheet 10 is then hand cut along hand cut lines 11 such that the green sheet 10 has dimensions of 1.6×0.8mm after sintering. In this regard, about 20mm is left, as a lug, on the periphery of the green sheet 10. In other words, a green sheet 10 is split into about 500 pieces to obtain cut pieces 12 of ceramic green sheet 10 which are then fired at 1600 deg.C in an oxidative atmosphere. A sintered ceramic thus obtained is then subjected top barrel polishing thus rounding each ridge and corner. This method produces a ceramic board 1 in which protrusions, e.g. burrs, are eliminated from all ridges 1a and corners 1b by forming a curved face having the radius of curvature in the range of 0.02-0.2mm thereat.
申请公布号 JPH08213719(A) 申请公布日期 1996.08.20
申请号 JP19950014813 申请日期 1995.01.31
申请人 KYOCERA CORP 发明人 KAWAGUCHI TOSHIRO;NAKAMURA TOSHIHIKO;SAKAI HISAMITSU;KAGAMI YUICHI
分类号 H05K1/02;H05K1/03;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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