发明名称 |
RADIATION-CURING COMPOSITION, ITS CURING METHOD AND PATTERN FORMING METHOD |
摘要 |
PURPOSE: To produce a radiation-curing compsn. causing a very slight decrease of its weight by curing, capable of curing with low intensity radiation and giving a heat resistant cured body and to provide a pattern forming method utilizing the compsn. CONSTITUTION: This radiation-curing compsn. contains a base generating material which generates a base by the action of radiation and polymer molecules each having an Si-H bond which reacts with an OH group by the action of the base and can form an Si-O bond and2 . When this compsn. is cured by irradiation, a mask is put between a coating film of this compsn. and a radiation source and the uncured part is dissolved and removed to form a pattern. |
申请公布号 |
JPH08211616(A) |
申请公布日期 |
1996.08.20 |
申请号 |
JP19950016193 |
申请日期 |
1995.02.02 |
申请人 |
DOW CORNING ASIA LTD |
发明人 |
BURAIAN ROBAATO HAAKUNESU;TACHIKAWA MAMORU |
分类号 |
C08K5/07;C08K5/16;C08K5/20;C08K5/205;C08K5/22;C08K5/28;C08K5/32;C08K5/33;C08K5/3412;C08K5/3415;C08K5/41;C08K5/42;C08L83/04;C08L83/05;C08L101/10;C09D5/00;C09D183/04;G03F7/004;G03F7/075;H01L21/027 |
主分类号 |
C08K5/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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