| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently dissipate the heat generated by a high output circuit pack, by installing an united closed loop cooling system in the circuit pack. SOLUTION: An united closed loop cooling system installed in a circuit pack 5 consists of a substrate 15, heat producing component 10 mounted on the substrate 15, a cooling unit 12 installed in a heat conduction relation with a specified one out of the heat producing component 10, a delivery system 20 for delivery cooling fluid, and a cooling fluid moving apparatus 26 for circulating the cooling fluid. The cooling fluid moving apparatus 26 circulates the cooling fluid through a cooling pipe segment 22 and a cooling unit 12, as a continuous loop. The heat generated from the heat producing component 10 is conducted to the cooling fluid in the cooling unit 12. The heat carried by the cooling fluid is dissipated to the external environment by natural convection, while circulating through the cooling pipe segment 22 and the cooling fluid moving apparatus 26. Thereby the heat which the high output circuit pack generates can be sufficiently dissipated. |
