Semiconductor chip and electronic module with integrated surface interconnects/components and fabrication methods therefor

摘要

A fabrication method and resultant electronic module having one or more surfaces enhanced with interconnects and components. Electronicmodules having, for example, resistors and capacitors integral with a side surface thereof are disclosed. Further described are electronic modules with interconnects electrically attaching for example, side to side, or side to end surfaces are described. Moreover, discussion of an electronic module having a Silicon Front Face chip is contained herein. Specific details of the fabrication method, resulting electronic module, and related wafer processing are set forth.