| 摘要 |
<p>A magnetron sputtering cathode assembly provides an annular target (80) of sputtering material located with a sputtering surface (82) facing a substrate (72) to be sputtered. An inner magnet (78) and an outer ring magnet (76) are positioned adjacent inner and outer edges of the sputtering surface. The outer ring magnet (76) is oriented so that its North-to-South magnetic orientation is substantially parallel to the plane defined by the sputtering surface while the inner magnet (78) is oriented so that its North-to-South magnetic orientation is substantially perpendicualr to the plane defined by the sputtering surface. A pair of walls (92, 94) extend at the inner and outer edges of the annular target away from the sputtering surface and toward the substrate. The walls and the magnets define a closed-loop array of radial magnetic lines (88) having improved target erosion and plasma-containing characteristics.</p> |
