Verfahren zur Formung von Anschlußhöckern auf elektrisch leitenden mikroelektronischen Verbindungselementen zum lothöcker-freien Tab-Bonden

摘要

The invention describes a process for shaping electrically conductive connection bumps on electrically conductive microelectronic connection components. In conventional processes, a connection bump is produced by a deep-drawing process in which the connection component is pressed with a punch into a recess in a carrier on which the connection component is secured. The disadvantage here is that, in addition to the connection bump on the connection component side facing the carrier, a depression which can impair the mechanical loading capacity and subsequent TAB bonding is produced on the side facing the punch. In contrast, in the process according to the invention, a shaping tool is pressed on one side against part of the surface of a connection component, one or a plurality of connection bumps being produced in this part of the surface owing to the geometry of the shaping tool and plastic deformation of the material constituting the connection component. Outside this partial area of the surface, the connection component is not subject to further deformation. The advantages of the process according to the invention are that no shaping carriers adapted to the desired connection bumps are required; conventional wire-bonding instruments can be used; the process is rapid, economical and accurate; and the mechanical loading capacity of a connection component, in particular a lead, is retained owing to the shaping of the connection bumps.