Verfahren und Vorrichtung zum Verdrahten von einer oder mehreren Schaltungsplatten

摘要

The present invention provides a wiring method and apparatus to wire two wiring board assemblies, each of which comprises: an insulating substrate; and a plurality of pressure terminals or busbars secured to the substrate, each having a press-connection portion formed with a slot. Wire connection is made by pressing the wires into the slots of the pressure terminals. The process of wiring is as follows. With two or more pairs of front and rear wire laying heads arranged on a wire laying plate that holds the insulating substrate, (a) a plurality of wires are parallelly laid between the two wiring board assemblies; (b) each wire is supported at two points of an intermediate portion of the wire to keep both end portions of each wire straight; (c) the wire laying heads are moved in a direction perpendicular to the wire laying direction and the first row wire is positioned on specified slots of the pressure terminals on the two wiring board assemblies; (d) the first row wire is pressed into the slots and cut; (e) the steps (c) and (d) are repeated to press the second to final row wires into specified slots of the pressure terminals on the two wiring board assemblies and cut these wires; and (f) the steps (a) to (e) are repeated.