发明名称 Semiconductor device with silicone ladder resin film
摘要 A semiconductor device has a stress-buffering film which is effective in buffering the stress caused by a moulding resin during sealing. The stress-buffering film is made of a silicone ladder resin represented by formula (I) in which each end group R may be the same or different and represents an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerisable unsaturated group, and n is an integer of 10 or larger.
申请公布号 DE19504684(A1) 申请公布日期 1996.08.14
申请号 DE1995104684 申请日期 1995.02.13
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 ADACHI, ETSUSHI, AMAGASAKI, HYOGO, JP;ADACHI, HISOSHI, AMAGASAKI, HYOGO, JP;YAMAMOTO, SHIGEYUKI, AMAGASAKI, HYOGO, JP;NISHIMURA, HIROYUKI, AMAGASAKI, HYOGO, JP;MINAMI, SHINTARO, AMAGASAKI, HYOGO, JP;TAZIMA, TOORU, ITAMI, HYOGO, JP;TOBIMATSU, HIROSHI, ITAMI, HYOGO, JP
分类号 C09D183/04;G03F7/075;H01L21/8247;H01L23/29;H01L23/31;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/312;H01L21/60 主分类号 C09D183/04
代理机构 代理人
主权项
地址