发明名称 |
High heat conductive body and wiring base substrate fitted with the same |
摘要 |
Disclosed is a high heat conductive body which consists of 30-99 wt. % of at least one of molybdenum and tungsten and 1 or more wt. % ceramic. A wiring base substrate fitted with such a high heat conductive body is also disclosed. Methods of producing such a high heat conductive body and a wiring base substrate are further disclosed.
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申请公布号 |
US5545598(A) |
申请公布日期 |
1996.08.13 |
申请号 |
US19940195085 |
申请日期 |
1994.02.14 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
OGAWA, KOUKI;YAMASAKI, KOZO;KATO, NAOMIKI |
分类号 |
C01G39/02;C01G41/00;C04B35/00;C22C32/00;H01L23/12;H01L23/14;H01L23/15;H01L23/373;H05K3/46;H05K7/20;(IPC1-7):B32B17/00 |
主分类号 |
C01G39/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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