| 摘要 |
PURPOSE: To obtain a composition which retains high heat conductivity, does not have too high a viscosity, and has a satisfactory workability by compounding a polyorganosiloxane with a polyorganohydrogensiloxane, a platinum catalyst, a heat-conductive filler, and an organosilicon compound adhesive. CONSTITUTION: This composition comprises 100 pts.wt. polyorganosiloxane (A) containing at least two Si-bonded alkenyl groups per molecule and having a viscosity (25 deg.C) of 50-100,000; a polyorganohydrogensiloxane (B) containing at least three Si-bonded hydrogen atoms per molecule in such an amount that the number of Si-bonded hydrogen atoms is 0.5-4.0 per alkenyl group contained in the component (A); a catalyst (C) selected among platinum and platinum compounds in an amount of 0.1-100ppm by weight in terms of platinum based on the component (A); 100-800 pts.wt. heat-conductive filler (D) having an average particle diameter of 5-20μm and containing at least 20% particles of 510μm; and 0.001-10 pts.wt. organosilicon compound adhesive (E) having an Si-H bond and an epoxy or another functional group in the molecule.
|
