发明名称 Electrical module mounting apparatus
摘要 An electrical module (125) is for mounting upon a circuit board (104). During circuit assembly, the electrical module (125) is placed upon a breakaway portion (117) of the circuit board (104) and a bracket assembly (103) is mounted to the circuit board (104) so as to position the electrical module (125). At the conclusion of circuit assembly, final assembly is initiated and the breakaway portion (117) is removed and the circuit board (104) is mounted into a housing (105). Preferably, the electrical module (125) is in direct contact with the housing (105) so as to maximize heat transfer.
申请公布号 US5546275(A) 申请公布日期 1996.08.13
申请号 US19950490257 申请日期 1995.06.14
申请人 MOTOROLA, INC. 发明人 MOUTRIE, MICHAEL F.;WHITMORE, III, ANDREW;HESS, DAVID M.;LAUGAL, JOHN C.;MINA, STEVEN M.;BOLER, MATTHEW J.
分类号 H01L23/40;H05K3/30;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
主权项
地址