| 摘要 |
PURPOSE: To improve quality and productivity together with plating performance and reliability by eliminating the variation, defective gloss, etc., in plating. CONSTITUTION: A gaseous mixture G1 of <=5.0×10<-5> in the mixing volumetric ratio of gaseous oxygen to gaseous nitrogen is introduced into a box 1 and the oxygen concn. of the gaseous mixture G2 in the box is controlled to 20 to 80ppm. The gases are throttled until the coating weight a1 of plating of a wire attains 250 to 600g/m<2> . At this time, this gas throttling device includes a supply line 10a for the gaseous nitrogen with a flow meter 18a to be controlled, a supply line 10b for the gaseous oxygen with a flow meter 18b to be controlled, a mixing line 20 which is connected to both supply lines, mixes the gaseous oxygen and gaseous nitrogen to form the gaseous mixture G1 of <=5.0×10<-5> in the mixing volumetric ratio in a mixer 21 and a gaseous mixture tank 22 and accumulates the pressure thereof, and an introducing line 30 which is connected to the mixing line, introduces the gaseous mixture G1 into the box by a reducing valve 32, a flow meter 34 and a solenoid valve 35 to be controlled and controls the oxygen concn. of the gaseous mixture G2 in the box to 20 to 80ppm.
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