发明名称 WELD BOND JOINING METHOD
摘要 PURPOSE: To provide a weld bond joining method capable of obtaining the sufficient welding strength even before the heat treatment hardening of the adhesive by improving the adhesive to be used in the weld bond joining method. CONSTITUTION: In the weld bond joining method where the adhesion and the resistance spot welding are jointly used, the adhesive to be used in the adhesion has the composition consisting of, by volume, l-15% of one or two or more kinds of the conductive metal, metallic oxide, metallic carbide, metallic nitride, metallic boride, or metallic silicate of powder whose grain size is <=10μm, of piece or flake shape whose thickness is >=0.5μm and whose size is 30μm in the thermosetting epoxy resin consisting of the epoxy resin and the latent hardening agent. This adhesive is used for the joining in the weld bond joining method.
申请公布号 JPH08206845(A) 申请公布日期 1996.08.13
申请号 JP19950280520 申请日期 1995.10.27
申请人 FURUKAWA ELECTRIC CO LTD:THE;SUNSTAR ENG INC 发明人 OKADA TOSHIYA;OKITA TOMIHARU;OGURI YASUHIRO;YAMASHITA KIICHI
分类号 B23K11/00;B23K11/11;B23K11/16;C09J163/00;(IPC1-7):B23K11/11 主分类号 B23K11/00
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