发明名称 |
Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
摘要 |
A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lines on both substrates are put in electrical contact and microwave/millimeterwave signals are transmitted between the substrates with a minimum of signal loss or reflection. |
申请公布号 |
US5545924(A) |
申请公布日期 |
1996.08.13 |
申请号 |
US19930102685 |
申请日期 |
1993.08.05 |
申请人 |
HONEYWELL INC. |
发明人 |
CONTOLATIS, ATHANASE;SOKOLOV, VLADIMIR |
分类号 |
H01L23/12;H01L23/02;H01L23/04;H01L23/66;H01L25/04;H01L25/065;H01L25/18;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H01L23/16 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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