发明名称 Process for patterned electroplating
摘要 A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of amninoalkylpyridine which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.
申请公布号 US5545307(A) 申请公布日期 1996.08.13
申请号 US19950417621 申请日期 1995.04.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DOSS, SAAD K.;MCKEAN, DENNIS R.;RENALDO, ALFRED F.;WILSON, ROBERT J.
分类号 C25D5/02;(IPC1-7):C25D5/02 主分类号 C25D5/02
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