发明名称 |
Process for patterned electroplating |
摘要 |
A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of amninoalkylpyridine which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.
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申请公布号 |
US5545307(A) |
申请公布日期 |
1996.08.13 |
申请号 |
US19950417621 |
申请日期 |
1995.04.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DOSS, SAAD K.;MCKEAN, DENNIS R.;RENALDO, ALFRED F.;WILSON, ROBERT J. |
分类号 |
C25D5/02;(IPC1-7):C25D5/02 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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