Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
摘要
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
申请公布号
US5545429(A)
申请公布日期
1996.08.13
申请号
US19940270086
申请日期
1994.07.01
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BOOTH, RICHARD B.;COOPER, EMANUEL I.;GIESS, EDWARD A.;KORDUS, MARK R.;KRONGELB, SOL;OSTRANDER, STEVEN P.;ROLDAN, JUDITH M.;SAMBUCETTI, CARLOS J.;SARAF, RAVI