| 摘要 |
PURPOSE: To fix mounted components immediately below and near a hybrid integrated circuit device by bending a metallic substrate in a U-shape with its element mounting surface inside. CONSTITUTION: A metallic substrate is formed in aπ-structure by bending both side edge sections of the substrate 3 in a U-shape along lines drawn at equal distances from both edges with the element mounting surface of the substrate 3 inside. As a result, wiring and elements on a printed board 2 can be passed through the inside of a hybrid integrated circuit device 1 and the heights of the elements can be increased to the height of the 7C-structure. In addition, the heights of the element mounted inside the device 1 can also be increased to the height of theπ-structure. Moreover, elements can be mounted over the three surfaces of theπ-structure and the heights of elements mounted on the surface of the substrate 3 with external leads 7 can be made substantially equal to the width of theπ-structure. Therefore, the hybrid integrated circuit device mounted with elements at a relatively high density can be mounted on the printed board 2 and wiring and elements can be mounted on the printed board 2 under the device 1.
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