| 摘要 |
PURPOSE: To prevent film exfoliation in a bonding pad part. CONSTITUTION: A semiconductor device is provided with a first insulating layer 12 formed on the main surface side of a semiconductor substrate 11, a first conducting layer 13 which is in contact with the first insulating layer 12, a second insulating layer 14 which is formed on the first insulating layer 13 and has an aperture part 14a, a second conducting layer 15 which is in contact with the first conducting layer 13 in the aperture part 14a, and a third conducting layer 16 which is in contact with the second conducting layer 15 and turns to the connection terminal of a bonding wire.
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