发明名称 PROBE PAD FOR TESTING OF INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To prevent the tip end of a probe from dropping, by forming a projecting or recessed part in an area where the probe penetrates when overdriving, and controlling the overdrive of the butting probe. SOLUTION: A probe 3 descends in an arrow direction to a surface of a pad electrode 1, advances and comes in touch with the surface. The probe 3 has flexibility in a vertical direction and overdrives in the arrow direction even after coming in touch with the surface of the pad electrode 1. The amount of the overdrive is set to be approximately 90 μm from a point where the tip end of the probe comes in touch with the pad electrode 1. A projection 2 has rigidity enough to withstand a press force of the probe 3. When the tip end of the prove butts against the V-shaped projection 2, the projection works as a stopper and at the same time guides the tip end to a top point of the projection 2. The tip end abuts the top point or a wall face, and the press force is increased downward, whereby a contact state to the pad electrode 1 is improved more. Accordingly, measurement errors can be reduced at a probe test.
申请公布号 JPH10325844(A) 申请公布日期 1998.12.08
申请号 JP19970134171 申请日期 1997.05.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIYOUZOU MASAHIKO
分类号 G01R1/06;H01L21/60;H01L21/66 主分类号 G01R1/06
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