| 摘要 |
PROBLEM TO BE SOLVED: To raise the moisture resistance of a resin package and to reduce the production cost of the package by a method, wherein the intermediate part of each lead member with one end part electrically connected with a semiconductor chip is embedded in a package main body, and an oxide layer formed in the surface of one part of the intermediate part is formed thicker than other oxide layer. SOLUTION: One end part of each lead 3 is extruded within a resin package main body and is connected with a semiconductor chip. At the same time, the other end part of the lead 3 connected with the outside is extruded to the outside of the main body and is exposed. In such a state, the intermediate parts 11 between inner and outer leads 3a and 3b of these leads 3 are embedded in the main body, that is, a resin constituting the main body. These leads 3 are electrically connected with the chip via the leads 3a. An oxide layer 11a is formed on at least one part of the surface of the part 11 of each lead 3 and has a thickness which is 1.5 to 500 times thicker than that of a natural oxide layer formed on other surfaces of the chip. |
