发明名称 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENTS HAVING A IMPROVED HEAT RESISTANCE
摘要 The resin composition comprises epoxy resin of cresol nobolak type,curing accelerator, inorganic filler, 4-10wt.% aryletherified phenol nobolak resin of formula(2) as hardner, and 1.0-15wt.% maleimide modified siloxane type of formula(1) as modifier. In formula, R1 is methylene and phenylene and substituted phenylene groups; R2 is methyl and phenyl and substituted phenyl; n is 1 when R1 is phenylene and substituted phenylene, 3 or 4 when R1 is methylene; m is 1-100.
申请公布号 KR960010844(B1) 申请公布日期 1996.08.09
申请号 KR19910011808 申请日期 1991.07.11
申请人 CHEIL IND. INC. 发明人 NAM, TAE - YOUNG
分类号 C08G59/16;C08G59/00;C08G59/17;C08G59/20;C08G59/32;C08G59/40;C08L61/06;C08L63/00;C08L63/04;C08L79/08;C08L83/04;H01L23/29;H01L23/31;(IPC1-7):C08L63/04;C08L83/08;C08L61/08 主分类号 C08G59/16
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