发明名称 WIRE BONDING EQUIPMENT
摘要 PURPOSE: To bring the die pad part of a lead frame into contact with the die pad mounting part of a heat adapter without forming a gap, at the time of clamping. CONSTITUTION: Notched parts 31a, 31b are formed in the die pad mounting part 31 of a heat adapter 30. Die pad suspension part fixing parts 23a, 23b of a lead frame 20 are mounted on the notched parts 31a, 31b, and clamped.
申请公布号 JPH08203950(A) 申请公布日期 1996.08.09
申请号 JP19950029927 申请日期 1995.01.25
申请人 SONY CORP 发明人 TSUNEMI DAIKI
分类号 H01L21/60;H01L21/603 主分类号 H01L21/60
代理机构 代理人
主权项
地址