WAFER RETENTION MEMBER FOR POLISHING AND METHOD FOR FITTING WAFER RETENTION MEMBER TO SURFACE PLATE

摘要

PURPOSE: To accurately and easily adhere a wafer retention member for polishing without any problem of the inclusion of foams and to provide the wafer retention member where the thickness change during polishing can be minimized and its fitting method. CONSTITUTION: A wafer retention member for polishing is provided with a transparent sheet-shaped substrate 1, a surface layer 2 which is formed on the surface of the substrate 1 and fits the wafer for polishing, and an electron ray curing type adhesive mass layer 4 formed on the reverse side of the substrate 1. A fine protrusion for air vent should preferably be formed on the reverse side of the adhesive mass layer 4.