| 摘要 |
PURPOSE: To cut a coupling part which couples packages of semiconductor devices on a lead frame, using a die, without breaking the package, without leaving any unwanted part of the package, and without changing the die even if the size of the package is changed. CONSTITUTION: A mechanism capable of inching in a direction of the arrow mark synchronously with a punch 1 which has a ladder-like groove and moves up and down with a package support 3 is provided for positioning the punch 1 and package support 3 on a coupling plate which couples one package with another. The coupling plate is twisted and bent by a slant face 1b of the punch 1 enough to give a stress to its root and then the root is cut by a cutting blade 1a with a little shear force. |
