| 摘要 |
PROBLEM TO BE SOLVED: To prevent short-circuit between electrodes and a crack of an electrode, by applying conductive metal material to the outer peripheral surface of first adhesive agent applied to the upper surface of a first electrode, and applying second adhesive agent with which the first electrode is bonded to a second electrode. SOLUTION: First adhesive agent 50 is arranged on the upper surface of a second electrode 41. Conductive metal material 51 which is electrically brought into contact with a first electrode 31 is applied to the outer peripheral surface of the first adhesive agent 50. In this case, the conductive metal material 51 is electrically connected with the second electrode 41. Second adhesive agent 52 is applied between the conductive metal material 51 and the first electrode 31. In this case, the second adhesive agent 52 protrudes from the side surfaces of the electrode 31 and the electrode 41 by the pressure of an integrated circuit chip 30 and a base 40. Thereby the electrode 31 and the electrode 41 can be electrically connected with each other. Hence, damage like cracks of an electrode is prevented and short-circuit between electrodes can be prevented. |
