| 摘要 |
PROBLEM TO BE SOLVED: To make low contact face compatible with high reliability. SOLUTION: A wire ball 1 for contact, which is obtained by forming a fine metal wire having conductivity and spring property into a ball, is housed for holding in a housing hole 4 of an insulating board 3, of which thickness is formed thinner than the diameter of the wire ball, and a part of the peripheral surface of the wire ball 1 is projected outside form both surfaces of the insulating board 3. Each electrode 5a, 6a of a LGA(land grid array) 5 and a printed board 6, which are arranged opposite to each other in the both surfaces of the insulating board 3, are electrically connected to each other via the wire ball 1. The wire ball 1 is not hollow, and it may be formed by evenly winding a metal wire, or a hollow wire ball may be used. Or a rubber-like elastic material can be used as a core of the ball. As a metal wire, a raw wire of copper or copper alloy is plated with Au/Ni, Sn/Ni, SnPb/Ni, or a raw wire made of noble metal alloy may be used. |
