| 摘要 |
PURPOSE: To make miniaturization of a high-density multilayer wiring board possible as well as to design optimally characteristics to necessary parts and the sizes of the parts by a method wherein the high-density multilayer wiring board with a minimum necessary area for connecting integrated circuits together, which are required for high-density connection on a board for supporting the whole of an integrated circuit device, is provided on the board. CONSTITUTION: An integrated circuit IC6 provided with several tens of pieces or thereabouts of connection electrodes 17 is provided on the upper half surface of a low- density multilayer printed-wiring board 12 and the electrodes 17 are connected with connection electrodes 15 via bonding wires 6. On the other hand, integrated circuits IC8 , which are respectively provided with about 200 connection electrodes 18, are provided on the upper surface of a high-density wiring board 14 and the electrodes 18 are connected with connection electrodes 16 via bonding wires 6. Moreover, the board 12 is sealed in a molded body 10 excluding the peripheral parts of connection electrodes 13. The board 14 with a minimum necessary area for connecting the integrated circuits IC8 together, which are connected with each other in a high density on the board 12 for supporting the whole of an integrated circuit device, is provided on the board 12. |
