| 摘要 |
<p>PURPOSE: To provide a semiconductor assembly structure, wherein a reduction in the thickness of a package is contrived together with cost reduction by reduction in the number of parts items and the manhours of assembly and the enhancement of reliability aiming at an intelligent power module or the like. CONSTITUTION: In a semiconductor device of a structure, wherein an independent power circuit block 2 and an independent control circuit block 5 are incorporated in a single package consisting of a heat dissipation metal base plate 1 and a terminal-integral type enclosing case 3, a circuit board 2a of the block 2 and a printed board 5a of the block 5 are juxtaposed on the plate 1 and both boards 2a and 5a are directly connected with each other via bonding wires 6 to provide an internal wiring.</p> |
