METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: To enable the leveling processing to be easily performed by precisely and efficiently understanding the characteristics of bumps deformed by the leveling process. CONSTITUTION: A semiconductor chip 2 made of plural bumps 1 arranged on the surface thereof is held by a semiconductor holder 5 from the rear side so that the levels of the bumps 1 may be made even simultaneously to perform the electrical connection test of the bumps 1. In such a constitution, at least either the semiconductor holder 5 or a leveling stage 6 may be heated.