| 摘要 |
PURPOSE: To provide a semiconductor chip storing package, with which the stored semiconductor chip in a container can function normally and reliably for a long time by preventing infiltration of water contained in the air inside the container that comprises an insulating board and a lid material. CONSTITUTION: A semiconductor chip storing package, that comprises an insulation board 1 that is made of resin and provided with a recess 1a to accommodates semiconductor chips and a lid material 2 that covers the recess 1a of the insulation board 1, is embedded with a metal plate 7 with a through hole 7a at the lower part of the recess 1a inside the insulation board 1 that is made of resin.
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