| 摘要 |
PURPOSE: To provide a semiconductor device which has a high yield a predetermined performance even when the device is built into the apparatus and a good aging performance. CONSTITUTION: A fixed insulating substrate 21 is surrounded by erecting a case 30 and a heat radiating plate 26 having a filling member 31 and a terminal holder 32 to seal with a sealing member 33 has a groove 28 as a deformation buffer between the central part fixed to the insulating substrate 21 and a part erecting the case 30. When sealing is executed, a warpage is generated on the heat radiating plate 26 due to solidification of the sealing member 33 but this warpage is generated due to deformation of only external circumference of the heat radiating plate 26 because of the groove 28 and the central part fixed to the insulating substrate 21 is not deformed. Therefore, the insulating substrate 21 fixed to the central part and the semiconductor chip 24 are not deformed, the yield can be improved, a strong force is applied to the periphery part at the time of assembling it into an apparatus but it does not apply to the central part, thereby any crack is not generated in the board and semiconductor chip. |
