发明名称 CONVEYING JIG OF WAFER
摘要 <p>PURPOSE: To bring a jig main body into contact with a wafer, only on the end portion of a protruding stripe part which portion is on the side opposite to the jig main body, by forming a ring type protruding stripe part surrounding an aperture, on the wafer retaining surface of the jig main body, and forming the end portion of the protruding stripe part which portion is on the side opposite to the jig main body, so as to be positioned on the same plane. CONSTITUTION: A conveying jig 1 is equipped with a planar and slender jig main body 2 for suction-retaining a wafer. A reduced pressure path 3 connected with a negative pressure source like a vacuum pump is formed along the length direction of the jig main body 2. An aperture 4 connected with the reduced pressure path 3 is formed on the wafer retaining surface 2a of the jig main body 2, i.e., the upper surface of the jig main body 2. A ring type protruding stripe part 5 surrounding the aperture 4 is formed on the wafer retaining surface 2a of the jig main body 2. As to the protruding stripe part 5, the end portion on the side opposite to the jig main body 2 is planar and formed so as to be continuously positioned on the same plane.</p>
申请公布号 JPH08203982(A) 申请公布日期 1996.08.09
申请号 JP19950006877 申请日期 1995.01.20
申请人 SONY CORP 发明人 BABA TAKAMASA
分类号 B65G49/07;C23C14/50;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
代理机构 代理人
主权项
地址