| 摘要 |
PURPOSE: To obtain a composite board which prevents metal scraps, generated due to a working operation, from being stuck to a thermoplatic polyimide resin layer by a method wherein a protective film whose thickness is in a specific range is brought into close contact with the surface of the thermoplastic polyimide resin layer. CONSTITUTION: A protective film 13 whose thickness is 1 to 10μm is brought into close contact with, and pasted on, the surface of a thermoplatic polyimide resin layer 12 for a composite board, for an LSI package, in which the thermoplastic polyimide resin layer 12 has been formed on one surface of a metal thin board 10. Thereby, metal scraps which are generated due to the working operation of the composite board for the LSI package are stuck to the protective film 13, and they are not stuck to the thermoplastic polyimide resin layer 12 as an adhesive layer. In addition, the metal scraps which have been stuck to the protective film 13 can be removed simply by stripping the protective film 13. Consequently, a lead frame or the like can be bonded to the surface of the thermoplastic polyimide resin layer which is not contaminated. |
