发明名称 ELECTRONIC PARTS MOUNTING BOARD, ELECTRONIC PARTS MOUNTING JIG, AND ELECTRONIC PARTS MOUNTING METHOD
摘要 PURPOSE: To provide an electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method by which electronic parts can be easily placed on a substrate and the yield of electronic parts can be improved by eliminating the occurrence of positional displacement at the time of soldering the parts by using the reflow, etc. CONSTITUTION: Guide pins are erected on a mounting jig 1 at the positions corresponding to the positions of the through holes 7 and side cut through holes 6 of a mounting board 3. The board 3 is provided with the through holes 7 and 6 along the outer periphery of electronic parts 4 so as to position the parts 4 to a prescribed position by using the guide pins.
申请公布号 JPH08204292(A) 申请公布日期 1996.08.09
申请号 JP19950031593 申请日期 1995.01.26
申请人 TOKIN CORP 发明人 NOBA TAKAYA
分类号 H05K13/04;H05K1/02;H05K3/30;H05K3/34 主分类号 H05K13/04
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