发明名称 BENDING DIE OF LEAD FRAME
摘要 PURPOSE: To enhance the abrasion resistance and work a shape of a working part with high precision by a method wherein an average thickness of a metal Co phase being a coupling phase is made less than a specific value. CONSTITUTION: WC of 1μm or less is manufactured by being directly carbonized from a specific mixture of particles W and carbon, and this is mixed with a specific amount of Co and molded at 0.5 to 2T/cm<2> and sintered for one hour at about 1300 to 1450 deg.C in a vacuum. Further, this is processed with a hot hydrostatic pressure press (HIP) at 1200 to 1350 deg.C at <1000 atmosphere to manufacture a superhard alloy material having particles and high viscosity. The superhard alloy is mainly composed of WC having an average crystalline particle size 1μm or less and TiC, and if an average thickness of a metal Co phase being a coupling phase is 0.15μm or less, a plating adhering amount becomes half or less, preferably. Further, if a surface roughness enhances, the plating adhering amount reduces naturally, and a 10-point average maximum height roughness is 1μm or less based on JIS B0601.
申请公布号 JPH08204093(A) 申请公布日期 1996.08.09
申请号 JP19950013526 申请日期 1995.01.31
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SHIMADA HIROYUKI;SAKAMOTO YOSHITO;FUKUI HARUYO;YOSHIOKA TAKESHI
分类号 C23C16/26;H01L23/48;H01L23/50;(IPC1-7):H01L23/50 主分类号 C23C16/26
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